Products
Printed Circuit Board(PCB)Industry words
Mike 2012-09-10 01:15:12
1ã? å??制ç?????????：printed circuit
2ã? å??制ço¿??????：printed wiring
3ã? å??制æ¿ï¼šprinted board
4ã? å??制æ¿ç?????????：printed circuit board (pcb)
5ã? å??制ço¿??????æ¿ï¼šprinted wiring board(pwb)
6ã? å??制å??ƒä»¶ï¼šprinted component
7ã? å??制æŽ??ç‚1：printed contact
8ã? å??制æ¿????????：printed board assembly
9ã? æ¿ï¼šboard
10ã? å•????å??制æ¿ï¼šsingle-sided printed board(ssb)
11ã? åŒ????å??制æ¿ï¼šdouble-sided printed board(dsb)
12ã? å??šå??‚å??制æ¿ï¼šmulitlayer printed board(mlb)
13ã? å??šå??‚å??制ç?????????æ¿ï¼šmulitlayer printed circuit board
14ã? å??šå??‚å??制ço¿??????æ¿ï¼šmulitlayer prited wiring board
15ã? 刚æ???å??制æ¿ï¼šrigid printed board
16ã? 刚æ???å•????å??制æ¿ï¼šrigid single-sided printed borad
17ã? 刚æ???åŒ????å??制æ¿ï¼šrigid double-sided printed borad
18ã? 刚æ???å??šå??‚å??制æ¿ï¼šrigid multilayer printed board
19ã? æŒ æ???å??šå??‚å??制æ¿ï¼šflexible multilayer printed board
20ã? æŒ æ???å??制æ¿ï¼šflexible printed board
21ã? æŒ æ???å•????å??制æ¿ï¼šflexible single-sided printed board
22ã? æŒ æ???åŒ????å??制æ¿ï¼šflexible double-sided printed board
23ã? æŒ æ???å??制ç?????????：flexible printed circuit (fpc)
24ã? æŒ æ???å??制ço¿??????：flexible printed wiring
25ã? 刚æ???å??制æ¿ï¼šflex-rigid printed board, rigid-flex printed board
26ã? 刚æ???åŒ????å??制æ¿ï¼šflex-rigid double-sided printed board, rigid-flex double-sided printed
27ã? 刚æ???å??šå??‚å??制æ¿ï¼šflex-rigid multilayer printed board, rigid-flex multilayer printed board
28ã? ??½å13å??制æ¿ï¼šflush printed board
29ã? ??‡??å??ž??Š??å??制æ¿ï¼šmetal core printed board
30ã? ??‡??å??žåŸoå??制æ¿ï¼šmetal base printed board
31ã? å??š??‡å¸ƒço¿å??制æ¿ï¼šmulit-wiring printed board
32ã? ??™¶ç????å??制æ¿ï¼šceramic substrate printed board
33ã? å??¼ç?????ƒ¶å??制æ¿ï¼šelectroconductive paste printed board
34ã? æ??¡å¡??ç?????????æ¿ï¼šmolded circuit board
35ã? æ??¡åŽ‹å??制æ¿ï¼šstamped printed wiring board
36ã? ??¡oåoå??‚压å??šå??‚å??制æ¿ï¼šsequentially-laminated mulitlayer
37ã? æ•??ço¿å??制æ¿ï¼šdiscrete wiring board
38ã? å¾®ço¿å??制æ¿ï¼šmicro wire board
39ã? ç??å??‚å??制æ¿ï¼šbuile-up printed board
40ã? ç??å??‚å??šå??‚å??制æ¿ï¼šbuild-up mulitlayer printed board (bum)
41ã? ç??å??‚æŒ å??制æ¿ï¼šbuild-up flexible printed board
42ã? ??¡??????å??‚åˆç?????????æ¿ï¼šsurface laminar circuit (slc)
43ã? 埋å????凸å????¿žå??制æ¿ï¼šb2it printed board
44ã? å??šå??‚??†œåŸoæ¿ï¼šmulti-layered film substrate(mfs)
45ã? å??‚??????å????å†??å??¼???šå??šå??‚å??制æ¿ï¼šalivh multilayer printed board
46ã? ??½½??Š??ç??‡æ¿ï¼šchip on board (cob)
47ã? 埋ç?????˜»æ¿ï¼šburied resistance board
48ã? æ??æ¿ï¼šmother board
49ã? å-æ¿ï¼šdaughter board
50ã? ??ƒŒæ¿ï¼šbackplane
51ã? ????¸æ¿ï¼šbare board
52ã? ????®ç›˜æ¿å??1心æ¿ï¼šcopper-invar-copper board
53ã? åŠ??æ?æŒ æ???æ¿ï¼šdynamic flex board
54ã? ??™æ?æŒ æ???æ¿ï¼šstatic flex board
55ã? å??æ?C-拼æ¿ï¼šbreak-away planel
56ã? ç????缆：cable
57ã?æŒ æ???æ??å13ç????缆：flexible flat cable (ffc)
58ã? ???C„??†œå¼?å??3：membrane switch
59ã? æ????åˆç?????????：hybrid circuit
60ã? 厚??†œï¼šthick film
61ã? 厚??†œç?????????：thick film circuit
62ã? ???C„??†œï¼šthin film
63ã? ???C„??†œæ????åˆç?????????：thin film hybrid circuit
64ã? äo????¿žï¼šinterconnection
65ã? å??¼ço¿ï¼šconductor trace line
66ã? ??½å13å??¼ço¿ï¼šflush conductor
67ã? ä¼ ??¾??ço¿ï¼štransmission line
68ã? ??????äo??：crossover
69ã? æ¿??¾1æ??å???：edge-board contact
70ã? å??žå¼oæ¿ï¼šstiffener
71ã? åŸoåo•ï¼šsubstrate
72ã? åŸoæ¿????：real estate
73ã? å??¼ço¿????：conductor side
74ã? å??ƒä»¶????：component side
75ã? ç„ŠæŽ??????：solder side
76ã? å??制：printing
77ã? ç½??æ ¼ï¼šgrid
78ã? 图å½??：pattern
79ã? å??¼ç????图å½??：conductive pattern
80ã? ??žå??¼ç????图å½??：non-conductive pattern
81ã? å-??ç¬|：legend
82ã? æ ‡å¿??：mark
PCBåŸoæç??»????æ??‡ä¸-??‹??æ?C‡å??1ç????：
1ã? åŸoæ：base material
2ã? å??‚压æ¿ï¼šlaminate
3ã? ??|†??‡??å??žç®??åŸoæ：metal-clad bade material
4ã? ??|†????œç®??å??‚压æ¿ï¼šcopper-clad laminate (ccl)
5ã? å•???騨|†????œç®??å??‚压æ¿ï¼šsingle-sided copper-clad laminate
6ã? åŒ???騨|†????œç®??å??‚压æ¿ï¼šdouble-sided copper-clad laminate
7ã? å??åˆå??‚压æ¿ï¼šcomposite laminate
8ã? ???C„å??‚压æ¿ï¼šthin laminate
9ã? ??‡??å??ž??Š????|†????œç®??å??‚压æ¿ï¼šmetal core copper-clad laminate
10ã? ??‡??å??žåŸo??|†????œå??‚压æ¿ï¼šmetal base copper-clad laminate
11ã? æŒ æ???|†????œç®??ç»ç¼˜???C„??†œï¼šflexible copper-clad dielectric film
12ã? åŸoä½??ææ?C™ï¼šbasis material
13ã? ????„æ??¸ææ?C™ï¼šprepreg
14ã? ç2˜ç»??ç??‡ï¼šbonding sheet
15ã? ????„æ??¸ç2˜ç»??ç??‡ï¼špreimpregnated bonding sheer
16ã? çŽ??æ???玻ç??ƒåŸoæ¿ï¼šepoxy glass substrate
17ã? åŠ æˆæ3•ç????å??‚压æ¿ï¼šlaminate for additive process
18ã? ????„制å†??å??‚??|†ç®??æ¿ï¼šmass lamination panel
19ã? å†??å??‚??Š??æ¿ï¼šcore material
20ã? 催åŒ?Cæ¿æ：catalyzed board ,coated catalyzed laminate
21ã? 涂??ƒ¶å‚¬åŒ?Cå??‚压æ¿ï¼šadhesive-coated catalyzed laminate
22ã? 涂??ƒ¶æ?? 催å??‚压æ¿ï¼šadhesive-coated uncatalyzed laminate
23ã? ç2˜ç»??å??‚：bonding layer
24ã? ç2˜ç»????†œï¼šfilm adhesive
25ã? 涂??ƒ¶ç2˜å??‚ç»ç¼˜???C„??†œï¼šadhesive coated dielectric film
26ã? æ?? æ????æ??????ƒ¶ç2˜å??‚??†œï¼šunsupported adhesive film
27ã? ??|†ç›?Cå??‚：cover layer (cover lay)
28ã? å??žå¼oæ¿æ：stiffener material
29ã? ????œç®??????：copper-clad surface
30ã? 去????œç®??????：foil removal surface
31ã? å??‚压æ¿????：unclad laminate surface
32ã? åŸo??†œ????：base film surface
33ã? ??ƒ¶ç2˜å??‚????：adhesive faec
34ã? 原å??‹å????æ??????：plate finish
35ã? ç2??????：matt finish
36ã? ço??å??：length wise direction
37ã? æ??¡å??：cross wise direction
38ã? å??a切æ¿ï¼šcut to size panel
39ã? ????š??†›ço¸??????|†????œç®??æ¿ï¼šphenolic cellulose paper copper-clad laminates(phenolic/paper ccl)
40ã? çŽ??æ???ço¸??????|†????œç®??æ¿ï¼šepoxide cellulose paper copper-clad laminates (epoxy/paper ccl)
41ã? çŽ??æ???玻ç??ƒå¸ƒåŸo??|†????œç®??æ¿ï¼šepoxide woven glass fabric copper-clad laminates
42ã? çŽ??æ???玻ç??ƒå¸ƒço¸å??åˆ??|†????œç®??æ¿ï¼š
epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
43ã? çŽ??æ???玻ç??ƒå¸ƒçŽ»ç??ƒço??ç»??å??åˆ??|†????œç®??æ¿ï¼š
epoxide non woven/woven glass reinforced copper-clad laminates
44ã? ??š??????玻ç??ƒå¸ƒ??|†????œç®??æ¿ï¼šployester woven glass fabric copper-clad laminates
45ã? ??š??????äoš??ƒo玻ç??ƒå¸ƒ??|†????œç®??æ¿ï¼špolyimide woven glass fabric copper-clad laminates
46ã? åŒ??©¬æ????????äoš??ƒoä¸??å??açŽ??æ???玻ç??ƒå¸ƒ??|†????œç®??æ¿ï¼š
bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47ã? çŽ??æ???åˆæˆço??ç»??布??|†????œç®??æ¿ï¼šepoxide synthetic fiber fabric copper-clad laminates
48ã? ??šå››ä1™çƒ??玻ç??ƒço??ç»??|†????œç®??æ¿ï¼šteflon/fiber glass copper-clad laminates
49ã? ??¶?????C„åž‹å??‚压æ¿ï¼šultra thin laminate
50ã? ??™¶ç????åŸo??|†????œç®??æ¿ï¼šceramics base copper-clad laminates
51ã? ç??«å??Cço¿??˜»æŒ¡åž‹??|†????œç®??æ¿ï¼šuv blocking copper-clad laminates
PCBço¿????????®¾??®¡????æ??‡ä¸-??‹??æ?C‡å??1ç????：
1ã? 原ç†å›¾ï¼šshematic diagram
2ã? ???»??¾??图：logic diagram
3ã? å??制ço¿??????布??®¾ï¼šprinted wire layout
4ã? 布??®¾æ?»å›¾ï¼šmaster drawing
5ã? å??制??? æ???®¾??®¡ï¼šdesign-for-manufacturability
6ã? ??®¡ç®??æœo??¾??助??®¾??®¡ï¼šcomputer-aided design.(cad)
7ã? ??®¡ç®??æœo??¾??助制??? ：computer-aided manufacturing.(cam)
8ã? ??®¡ç®??æœo??›†æˆåˆ¶??? ：computer integrat manufacturing.(cim)
9ã? ??®¡ç®??æœo??¾??助å????ç??‹ï¼šcomputer-aided engineering.(cae)
10ã? ??®¡ç®??æœo??¾??助æ??‹????•ï¼šcomputer-aided test.(cat)
11ã? ç????å-??®¾??®¡??‡aåŠ??åŒ?C：electric design automation .(eda)
12ã? å????ç??‹??®¾??®¡??‡aåŠ??åŒ?C：engineering design automaton .(eda2)
13ã? 组??????®¾??®¡??‡aåŠ??åŒ?C：assembly aided architectural design. (aaad)
14ã? ??®¡ç®??æœo??¾??助制图：computer aided drawing
15ã? ??®¡ç®??æœoæŽ??制显ç??o：computer controlled display .(ccd)
16ã? 布å???：placement
17ã? 布ço¿ï¼šrouting
18ã? 布图??®¾??®¡ï¼šlayout
19ã? ??‡å¸ƒï¼šrerouting
20ã? æ??¡æ‹Ÿï¼šsimulation
21ã? ???»??¾??æ??¡æ‹Ÿï¼šlogic simulation
22ã? ç?????????æ??¡æ‹Ÿï¼šcircit simulation
23ã? æ??¶åoæ??¡æ‹Ÿï¼štiming simulation
24ã? æ??¡å??åŒ?C：modularization
25ã? 布ço¿å®ŒæˆçŽ‡ï¼šlayout effeciency
26ã? æœoå™??æ??¿??æ ¼å¼ï¼šmachine descriptionm format .(mdf)
27ã? æœoå™??æ??¿??æ ¼å¼æ•??æ®åo??：mdf databse
28ã? ??®¾??®¡æ•??æ®åo??：design database
29ã? ??®¾??®¡åŽŸç‚1：design origin
30ã? 优åŒ?C（??®¾??®¡ï¼??：optimization (design)
31ã? ä¾›??®¾??®¡ä¼˜åŒ?Cåæ ‡??½??：predominant axis
32ã? ??¡??æ ¼åŽŸç‚1：table origin
33ã? ??•œåƒï¼šmirroring
34ã? ??©??åŠ??æ?C‡ä»¶ï¼šdrive file
35ã? ä¸-??????æ?C‡ä»¶ï¼šintermediate file
36ã? 制??? æ?C‡ä»¶ï¼šmanufacturing documentation
37ã? ??˜Ÿåˆ??æ????æ????æ•??æ®åo??：queue support database
38ã? å??ƒä»¶å®??置：component positioning
39ã? 图å½??显ç??o：graphics dispaly
40ã? æ????ä¾‹å› å-：scaling factor
41ã? æ??«æå¡«å????：scan filling
42ã? 矩å½??å¡«å????：rectangle filling
43ã? å¡«å????域：region filling
44ã? 实ä½????®¾??®¡ï¼šphysical design
45ã? ???»??¾????®¾??®¡ï¼šlogic design
46ã? ???»??¾??ç?????????：logic circuit
47ã? å??‚次??®¾??®¡ï¼šhierarchical design
48ã? ??‡a??¡¶å??下??®¾??®¡ï¼štop-down design
49ã? ??‡aåo•å??上??®¾??®¡ï¼šbottom-up design
50ã? ço¿ç½??：net
51ã? æ•??å-??åŒ?C：digitzing
52ã? ??®¾??®¡????„则æ??æŸ??：design rule checking
53ã? ?????（布ï¼??ço¿å™??：router (cad)
54ã? ç½??络??¡??：net list
55ã? ??®¡ç®??æœo??¾??助ç?????????分æžï¼šcomputer-aided circuit analysis
56ã? å-ço¿ç½??：subnet
57ã? ç›®æ ‡å‡½æ•??：objective function
58ã? ??®¾??®¡åŽå??„ç†ï¼špost design processing (pdp)
59ã? äo??äo??å¼åˆ¶å›¾??®¾??®¡ï¼šinteractive drawing design
60ã? ????1ç????矩??˜??：cost metrix
61ã? å????ç??‹å›¾ï¼šengineering drawing
62ã? æ?C1å??框图：block diagram
63ã? ??¿??宫：moze
64ã? å??ƒä»¶å??†åo|：component density
65ã? å??¡å›žå??®?????å??˜????®????˜ï¼štraveling salesman problem
66ã? ??‡aç????åo|：degrees freedom
67ã? å????åo|：out going degree
68ã? å‡oåo|：incoming degree
69ã? 曼å??ˆ??¡¿????ç|»ï¼šmanhatton distance
70ã? æ¬??å‡ ??‡Œå¾??????ç|»ï¼šeuclidean distance
71ã? ç½??络：network
72ã? ??˜??åˆ??：array
73ã? æ®??：segment
74ã? ???»??¾??：logic
75ã? ???»??¾????®¾??®¡??‡aåŠ??åŒ?C：logic design automation
76ã? 分ço¿ï¼šseparated time
77ã? 分å??‚：separated layer
78ã? 定??¡oåo：definite sequence